ASTM D4732-13(R2020) pdf free download

ASTM D4732-13(R2020) pdf free download.Standard Specification for Cool-Application Filling Compounds for Telecommunications Wire and Cable
1. Scope
1.1 This specification covers a variety of compounds used for filling the air spaces in telecommunications wires and cables (both electrical and fiber optic) for the purpose of preventing water and other undesirable fluids from entering or migrating through the cable structure. (For related standards see Specifications D4730 and D4731.) 1.2 A cool-application compound is a material that has sufficiently low viscosity that it does not require heating. 1.3 The values stated in SI units are to be regarded as standard. The values given in parentheses after SI units are provided for information only and are not considered standard. 1.4 This international standard was developed in accor- dance with internationally recognized principles on standard- ization established in the Decision on Principles for the Development of International Standards, Guides and Recom- mendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
8. Electrical Properties
8.1 When a Type II (electrical) filling compound is specified, the compound shall exhibit the electrical properties in 8.1.1 and 8.1.2. The electrodes used shall be parallel plates of solid or foil metal of a size and shape appropriate for the specimen holder. Other electrodes are used as agreed upon between the producer and the purchaser. The voltage applied and the time of the electrification shall be appropriate for the instrumentation used and as agreed upon between producer and purchaser. 8.1.1 When tested, in accordance with Test Method D150 or D4872, at a temperature of 23 6 3 °C, the dissipation factor shall not exceed 0.0010 at a frequency of 1 MHz and the permittivity shall not exceed 2.30. 8.1.2 When tested, in accordance with Test Method D257, at a temperature of 23 6 3 °C, the volume resistivity shall be not less than 10 13 Ω·cm.
9. Physical Properties
9.1 Filling compound furnished under this specification shall inhibit the corrosion of any metallic wire and cable elements with which it comes in contact, while serving as a radial and longitudinal barrier to moisture transmission. Con- tact of the filling compound with any cable component shall not cause degradation of performance of the cable component. The filling compound shall display adhesive properties to provide adhesion between metallic sheath elements and the outer jacket materials of wire and cable. 9.2 Other Physical Properties: 9.2.1 Other physical properties requirements such as Flash Point (for example, Test Method D92), high-temperature drip/ oil separation (syneresis) in the raw material state (for example, Test Method D1742), evaporation loss (for example, Test Method D972), and water resistance (for example, Test Method D1264), and the like, shall be as agreed upon between the producer and the purchaser. 9.2.2 The purchaser (individual cable manufacturer or other) shall specify any other expected requirements needed to ensure compliance with such end-product requirements as cold-bend, low-temperature flexibility, and the like.
10. General Requirements
10.1 All filling compounds manufactured in accordance with this specification shall meet the following requirements: 10.1.1 Homogeneity—The compound shall be homoge- neous and free of agglomerates. 10.1.2 Color and Opacity—The compound shall be as nearly colorless as is commercially feasible, consistent with the requirements of the end products for which the filling com- pound is intended. In general, identification of cable members coated with filling compound shall not be significantly inhib- ited because of filling compound color or opacity.10.1.3 Color Stability—After aging a specimen of filling compound in a suitable container for a period of 120 6 1 h (5 days) at a temperature of130 °C (266 °F) in a static air oven, measure the compound color in accordance with Test Method D1500. Unless otherwise specified, the color of the aged compound shall not exceed 2.5. 10.1.4 Foreign Material—The compounds shall be free of dirt, metallic particles, and other foreign matter.